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Keysight Technologies and Intel Foundry have announced a significant collaboration aimed at enhancing their EMIB-T (Embedded Multi-Die Interconnect Bridge Technology) for artificial intelligence (AI) and data center applications. This partnership seeks to improve the performance and efficiency of semiconductor packaging, which is crucial for meeting the growing demands of modern computing environments.
EMIB-T technology allows for the integration of multiple chiplets within a single package, facilitating faster data transfer and reduced latency. This is particularly beneficial for AI workloads, which require high-speed processing and efficient data handling. By leveraging this advanced packaging solution, both companies aim to provide enhanced capabilities for data centers, enabling them to handle increasingly complex tasks and larger datasets.
The collaboration underscores the importance of innovative semiconductor solutions in addressing the needs of AI and data-intensive applications. As the demand for high-performance computing continues to rise, the advancements in EMIB-T technology are expected to play a pivotal role in shaping the future of data center infrastructure.
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